ST-1000 Zero Emission Inline Cleaning Machine

Application: PCBA cleaning, IGBT cleaning, Semiconductor BGA cleaning, FCCSP inverted packaging. Suitable for high-capacity semiconductor BGA, flip chip, SiP system level packaging, FCCSP flip chip packaging, IGBT, Lead Frame, PLP, IC, PCBA, and carrier board flux residue cleaning. Features a magnetic transmission system, condensation recovery system, automatic addition ratio system, independent electric diaphragm pump, and multi-stage circulating filtration. \

Equipment size: 10000(L) x 2000(W) x 1720(H) mm.
Mesh belt width: 600mm.
Conveying speed: 10-150cm/min.
Power supply: AC380V 50HZ three-phase five wire.
Total power: 198kW, 336A.
Net weight: approx. 6500kg.