MS-11 Series Outstanding performance at reasonable price
Outstanding performance
- Super high resolution CXP camera and precision 6㎛ lens.
- Solder paste inspection up to 0201(㎜) size component pad.
- High accuracy & repeatability.
- Shadow-free dual projection 3D measurement.
- Various camera line-up from high-performance 25 mega pixel to economical 4 mega pixel.
Auto PCB warpage compensation
Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine.
Intellisys® : Total process management system for improving productivity and achieving smart factory.
Standard 3D AOI for various manufacturing process.
