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MS-15 Series Precision 3D SP for second process of semiconductor manufacturing

The world’s best performance 3D SPI

  • Super high resolution CXP camera and precision 6㎛ lens.
  • Solder paste inspection up to 0201(㎜) size component pad.
  • 30㎛ height solder paste inspection.
  • Shadow-free dual projection 3D measurement.
  • High accuracy and repeatability with linear motor drive system.

Auto PCB warpage compensation

Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine.

Intellisys® : Total process management system for improving productivity and achieving smart factory.

High precision 3D SPI that can be applied to solder paste inspection of semiconductor second process, mini-LED and micro-LED.