MS-15 Series Precision 3D SP for second process of semiconductor manufacturing
The world’s best performance 3D SPI
- Super high resolution CXP camera and precision 6㎛ lens.
- Solder paste inspection up to 0201(㎜) size component pad.
- 30㎛ height solder paste inspection.
- Shadow-free dual projection 3D measurement.
- High accuracy and repeatability with linear motor drive system.
Auto PCB warpage compensation
Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine.
Intellisys® : Total process management system for improving productivity and achieving smart factory.
High precision 3D SPI that can be applied to solder paste inspection of semiconductor second process, mini-LED and micro-LED.
