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MV-3 Series Versatile Benchtop 2D AOI

Great inspection performance

  • Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting.
  • Angled camera system for solder inspection under J-lead, no-lead and coil component.
  • Lifted BGA package and CSP package inspection by laser unit

Multi-Vision® : simultaneous 5-dimension (Center, East, West, South, North) inspection by 18 mega pixel angled cameras.

Intellisys® : Total process management system for improving productivity and achieving smart factory.

Simple and easy auto programming using IPC international standard library.

Benchtop 2D AOI system meets outstanding performance, economy and space utilization.