AC-7000S Inline cleaning machine

Application: Flip-chip packaging, Lead Frame Encapsulation, Semiconductor BGA cleaning, FCCSP inverted packaging. Segmented mesh belt design with synchronous upper and lower belts for cleaning thin plates, reducing liquid consumption and fixture costs.
Features a fully covered drawing board and transparent tempered glass window for direct observation.

Equipment size: 7100(L) x 1853(W) x 1720(H) mm.
Mesh belt width: 570/600mm (online/offline).
Power supply: AC380V 50HZ three-phase five wire.
Total power: 205kW, 358A.
Net weight: approx. 4600kg.